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Circuit imprimé Coard

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Mechanicallysupportsandelectricallyconnectselectroniccomponentsusingconductivetracks Aprintedcircuitboard (PCB), padsandotherfeaturesetchedfromcoppersheetslaminatedontoanon-conductivesubstrate. PCBscanbesinglesided(onecopperlayer),doublesided(twocopperlayers)ormulti-layer(outerandinnerlayers). Multi-layerPCBsallowformuchhighercomponentdensity.Conductorsondifferent layersareconnectedwithplated-throughholescalledvias.

AdvancedPCBsmaycontaincomponents-condensateurs, resistorsoractivedevices-embeddedinthesubstrate. FR-4glassepoxyistheprimaryinsulatingsubstrateuponwhichthevastmajorityofrigidPCBsareproduced.AthinlayerofcopperfoilislaminatedtooneorbothsidesofanFR-4panel.Circuitryinterconnectionsareetchedinto copperlayerstoproduceprintedcircuitboards.

Complexcircuitsareproducedinmultiplelayers.Printedcircuitboardsareusedinallbutthesimplestelectronicproducts.AlternativestoPCBsincludewirewrapandpoint-to-pointconstruction.PCBsrequiretheadditionaldesignefforttolayoutthecircuit,butmanufacturingandassemblycanbeautomated. ManufacturingcircuitswithPCBsischeaperandfasterthanwithotherwiringmethodsascomponentsaremountedandwiredwithonesingle partie. En outre, opérateur wiringerrorsareeliminated.

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